APF VaporSolve® Joint Filler

APF VaporSolve® JOINT FILLER is a specially formulated, highsolids thixotropic epoxy paste, designed for use over concrete with high moisture levels for the purpose of isolating the concrete from moisture sensitive flooring. APF VaporSolve® JOINT FILLER is suitable for concrete substrates indicating up to 99% RH when measured in accordance with ASTM F2170. VaporSolve® JOINTFILLER is utilized to fill control/contraction and other non-moving joints with a material compatible with the APF VaporSolve and VaporSolve Ultra systems. This system should only be applied over concrete that has never been treated with reactive silicate curing compounds or densifiers. If the concrete surface is known or suspected of having been treated with sodium or potassium silicate products, use of APF VaporSolve Primer is required.

APF VaporSolve® JOINT FILLER has been formulated for thixotropic viscosity yet excellent substrate wetting capabilities to promote penetration and adhesion. The special curing agent allows for adhesion to damp concrete. The product may be applied at temperatures between 65 - 85°F (18 - 30ºC).